Laminate for the formation of beam leads for ic chip bonding
CA 1301522 C · Owner: Eastman Kodak Company · Inventors: Mcconkey, Robert C.; Noonan, John M.; Molaire, Michel F.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A laminate adapted for manufacturing frames, of metal beam leads that are bonded to integrated circuit chips, comprises, a) a flexible metal strip b) a layer of a first resist adhered to one surface of the metal strip, and, c) a layer of a second resist adhered to the opposite surface of the metal strip, the second resist being a negative-working resist comprising, (1) a polymeric binder (2) a photopolymerizable monomer mixture and, (3) a photoinitiator composition. The negative-working resist exhibits excellent flexibility and adhesion to the metal and superior performance during high temperature processing whereby it serves effectively as a support for the beam leads.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 26, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 26, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.