Semiconductor package
CA 1300761 C · Owner: International Business Machines Corporation · Inventors: Ward, William C.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
In an encapsulated semiconductor module in which a semiconductor chip, having a major surface with terminals thereon, is deposed within the encapsulating material, a plurality of self-supporting unitary, discrete, and continuous lead frame conductors formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 12, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 12, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.