Wire bonds and electrical contacts of an integrated circuit device
CA 1300282 C · Owner: Long, Jon · Inventors: Long, Jon
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Jon Long, ABSTRACT An integrated circuit device package includes a rigid frame and flexible tape assembly having wire leads between the die attach pad, conductive lead fingers and the I.C. chip. A dam structure prevents resin flow to ensure proper wire bonding and a wedge prevents electrical shorting. A recognition pattern enables precise wire bonding. A epoxy molding compound is interposed in cavities formed in a Kapton layer to preclude delamination.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 5, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 5, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.