Module sealing structure
CA 1298667 C · Owner: Fujitsu Limited · Inventors: Moriizumi, Kiyokazu; Kawano, Kyoichiro; Seyama, Kiyotaka
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A sealed module includes a cold plate having a passage through which a cooling medium flows, a plurality of bellows structures having first ends which communicate with the passage in the cold plate to form a thermal conduction type cooling system and a plated printed circuit having a substrate and a plurality of integrated circuit elements provided on a first surface of the substrate. The integrated circuit elements are in contact with ends of the bellows structures. A metal fitting secured on the cold plate has a flange disposed beneath the other surface of the substrate to present a junction between the second surface of the substrate and the flange of the metal fitting. A polyimide layer …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted April 7, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended April 7, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.