Method of assembling tab bonded semiconductor chip package
CA 1297597 C · Owner: Digital Equipment Corporation · Inventors: Doe, Ralph W.; Brown, Kenneth M.; Hansen, Stephen P.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package for housing fabricated semiconductor chips is disclosed. The package has ceramic base with a raised outer shelf extending around its periphery. The outer shelf defines a space in the package where the chip is seated. A lead frame with a number of individual conductive leads is disposed over the outer shelf. A section of tape automated bonding tape is used to provide electrical connections between bonding points on the chip and the lead frame leads; the tape automated bonding tape carries a number of conductive leads each of said leads having an inner lead portion attached to a chip bonding point and an outer lead portion attached to a lead frame lead. A frame is secured over the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted March 17, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended March 17, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.