Method for fabricating multilayer circuits
CA 1297596 C · Owner: Rellick, Joseph R. · Inventors: Rellick, Joseph R.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention is directed to a method for fabricating multilayer circuits on rigid ceramic substrates using conventional dielectric green tape and thick film conductive pastes in which the number of firing steps is substantially reduced while maintaining excellent X-Y dimensional stability. The method comprises the steps of:, (a) providing a dimensionally stable electrically insulative substrate;, (b) applying to the substrate a patterned conductive layer;, (c) laminating to the patterned conductive layer and exposed areas of the substrate a layer of dielectric green tape having vias formed therein, the vias being in registration with the patterned conductive layer of step (b); (d) filling …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted March 17, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended March 17, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.