Method of manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material
CA 1294716 C · Owner: Philips Electronics N.V. · Inventors: Broadbent, Eliot K.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
PHA 1147 20 13.3.1987, ABSTRACT:, Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material. A planar electrical interconnection system suitable for an integrated circuit is created by a process in which an insulating layer (31) having a planar upper surface is formed on a substructure after which openings (32) are etched through the insulating layer A conductive planarizing layer (33) having a planar upper surface is formed on the insulating layer and in the openings by an operation involving isotropic deposition of a material, preferably tungsten to create at, least a portion of the planarizing layer extending from its upper surface …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted January 21, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended January 21, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.