Integrated circuit die with resistive substrate isolation of multiple circuits

Abstract From the Canadian patent

Abstract, An improved integrated circuit die (45) with multiple circuits on the same substrate of semiconductor material is formed with circuit elements of the multiple circuits grouped respectively into at least first and second circuit areas or sections (46, 48) of the die. The first and second circuit sections (46, 48) of the die are separated and spaced from each other by a moat or separating boundary line (50). The separating boundary line is formed using appropriate mask lines on the fabrication masks. The separating boundary line (50) is composed of the substrate semiconductor material (60) between the circuit sections (46, 48). The separating boundary line (50) is formed without …