Near-linear spring connect structure for flexible interconnect circuits

Abstract From the Canadian patent

A printhead for a thermal ink jet printer of the like is brought into good electrical contact with raised electrical contacts on a flexible interconnect circuit by the use of a molded near-linear spring connect structure. This novel structure includes a horizontal central locating member form which a plurality of resilient hollow cylinders extend vertically upward and in alignment with the electrical contacts on the flexible interconnect circuit. Since there is a near-linear deflection of the cylinder walls with increasing force applied thereto, good electrical contact is achieved between the printhead and the flex circuit using a minimum of force, thereby minimizing the likelihood of …