Simultaneous vertical-seismic profiling and surface seismic acquisitionmethod

Abstract From the Canadian patent

An inventive method for simultaneously collecting depth-of-focus vertical seismic profiling (VSP) data and three-dimensional surface seismic data is disclosed. At least one seismic sensor is deployed at a predetermined depth of a borehole and raised in increments determined by the survey. A seismic source and a plurality of seismic sensors may be deployed at the surface along a partial arc offset from the top of the borehole by a distance inversely proportional to the depth of the sensor in the borehole. The seismic source generates a seismic signal at a plurality of points in a circular path around the borehole. Once a circle has been completed the borehole, sensor is raised, and the …