Circuit for measuring the dynamic characteristics of a package for high-speed integrated circuits and a method for measuring said dynamic characteristics
CA 1292513 C · Owner: Thomson Hybrides Et Microondes · Inventors: Gloanec, Maurice; Lailler, Jean-Luc; Jarry, Jacques-Jean
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A circuit for measuring the dynamic characteristics of encapsulating packages for high-speed integrated circuits includes at least two amplifiers integrated on a semiconductor substrate. These amplifiers have the same input and output impedances as those of the high-speed circuit to be encapsulated within the package. The amplifiers are located in widely spaced relation in order to ensure that there is no internal coupling. Depending on the measurements to be performed, the two amplifiers are mounted in parallel or in antiparallel relation. In order to measure the dynamic characteristics of a package a, measuring circuit is mounted within a package and a signal (Ve) is addressed-to an input …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted November 26, 1991. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended November 26, 2008.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.