Solder flow well for reflowing solder of multipin components
CA 1288171 C · Owner: Ritter, Rodney Leon · Inventors: Altpeter, James Edward; Sinkunas, Peter Joseph; Ritter, Rodney Leon
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A solder well configured to abut and enclose the though hole pattern on a printed circuit board to allow the reflow of solder and removal of a multipin electronic component without affecting the integrity of adjacent solder joints of components disposed within or adjacent the through hole pattern.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted August 27, 1991. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended August 27, 2008.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.