Apparatus for dry processing a semiconductor wafer

Abstract From the Canadian patent

Abstract of the Disclosure, A method and apparatus of dry processing a semiconductor wafer including processes of vacuum baking and dry silylation provides a gaseous atmosphere of pressure up to 760 Torr against the surface of the wafer, one or more of the constituents of the gas being obtained from a liquid fluid source of the constituent including a metering device that controls flow of the liquid fluid from a remote reservoir and feeds it to a vaporizer that converts the fluid to a vapor gas at pressure up to 760 Torr and feeds the vapor gas at that pressure into a wafer processing chamber where the particular dry process involving the vapor gas is carried out on the wafer surface. In a …