Sealing and stress relief layers and use thereof
CA 1286791 C · Owner: Dubetsky, Derry J. · Inventors: Kumar, Ananda H.; Shih, Da-Yuan; Dubetsky, Derry J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymeric overlayers with interconnection between the underlying via or pad metallurgy and the device, chip wire or, pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted July 23, 1991. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended July 23, 2008.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.