Multilayer interconnection system for multichip high performance semiconductor packaging
CA 1284692 C · Owner: Digital Equipment Corporation · Inventors: Wu, Andrew L.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for fabricating a multilayer interconnection system that is fully planar with completely sealed and corrosion resistant conductors separated by dielectric material. The method involves forming a dielectric sub-layer overlying a base layer, the sub-layer being non-soluble after it is cured. A sacrificial sub-layer is then formed over the dielectric sublayer, the sacrificial sub-layer being insoluble after it is cured. A portion of the sacrificial sub-layer is removed to expose a portion of the dielectric sub-layer. The exposed portion of the dielectric sub-layer and a selected portion surrounding the exposed portion is removed to expose a portion of the base layer with an exposed …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 4, 1991. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 4, 2008.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.