Cooling system for three-dimensional ic package
CA 1283225 C · Owner: Mine, Shinji · Inventors: Mine, Shinji
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A cooling system for a three-dimensional IC package in which a plurality of substrates each mounting ICs on its one or both surfaces are laminated with a predetermined interval therebetween, includes a cold plate in which holes are formed at positions corresponding to the ICs and a cooling fluid path are formed around the holes a, heat conductive piston, inserted in each hole of the cold plate while keeping a small gap with respect to the inner wall of the hole, and biased by a spring to be moved in the hole, for conducting, when one end thereof is brought into contact with a heat radiating surface of the IC the heat, to the cold plate, and a device for interrupting a contact between the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted April 16, 1991. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended April 16, 2008.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.