Mounting of saw devices
CA 1281810 C · Owner: Macdonald, Brian M. · Inventors: Macdonald, Brian M.; Rogerson, Stephen P.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A SAW device is formed by applying metallised areas to a surface of a SAW substrate and attaching conductive leads to the metallised areas. The substrate is inverted and located on a hybrid circuit so that the leads contact and are supported on conductive areas of the circuit. This mounting arrangement minimises the stresses which occur in the substrate in its operational life. A novel diamondshape for the device is also disclosed.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted March 19, 1991. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended March 19, 2008.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.