Outer lead tape automated bonding system

Abstract From the Canadian patent

A method for aligning and bonding the outer leads of the conductive fingers of a tape-and-semiconductor-chip sub-assembly to a package substrate is disclosed. Each section of tape is provided with an inner support ring and an outer support ring. The conductive fingers extend from under the inner support ring to under the outer support ring. The outer support ring is spaced away from the inner support ring to expose portions of the tape outer leads therebetween. The tape-and-chip sub-assembly is positioned over the package substrate so the outer leads are in register with the appropriate package substrate leads. A deposit of flux is applied to at least one location between the substrate and …