Multilayer printed wiring boards
CA 1278471 C · Owner: Kollmorgen Corporation · Inventors: Kohm, Thomas S.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A multilayer printed wiring board is described having (1) an inner layer conductive pattern on an organic insulating base material, (2) a poly(vinyl acetal)-phenolic resin coating containing an amine substituted organic zirconate or titanate coupling agent, (3) a dielectric insulating layer, (4) a bonding composition capable of being adhesion promoted for electroless metal deposition comprising a phenolic resin having at least two methylol groups and substantially free of methyl ether groups a, heat resistant aromatic or cyclic resin having functional groups capable of reacting with the methylol groups without the evolution of water, and (5) an outer conductive pattern the multilayer board …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted January 2, 1991. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended January 2, 2008.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.