Method of and apparatus for bailout elimination and for enhancing plating bath stability in electrosynthesis/electrodialysis electroless copper purification process

Abstract From the Canadian patent

A forced air ambient temperature, evaporator, coupled to an electroless copper plating bath and to a purification system for replenishing and maintaining the stability of the plating bath, which bath tends to become depleted as the result of the reduction of water soluble cupric salt in an alkaline solution under copper plating and reducing conditions and in which the rate of evaporation of water from the surface thereof is insufficient to preclude growth in the volume thereof resulting from liquid additions thereto required to replace consumed constituents, thus giving rise to a need for bailout to prevent overflow thereof solves the, following problems: evaporation is independent of …