Microwave method of perforating a polymer film

Abstract From the Canadian patent

Abstract of Disclosure:, A method of forming perforations in polymer film includes the steps of forming a conductive film pattern on the film preferably in a bow tie shape using a material with a moderate resistivity and applying a microwave field across the film for a few seconds whereupon sufficient electrical energy is dissipated in the conductive spot to perforate the polymer. This method is operative even when the polymer film is laminated between layers of other dielectric material prior to the microwave processing.