Electroplating tape and method for using

Abstract From the Canadian patent

A method for applying preselected abrasive particles to a cleaned first article surface adjacent a second article surface selected to be substantially free of such abrasive particles includes disposing on the first article surface a first electrically non-conductive tape segment including pores large enough to allow passage of electrodeposition current and electrolyte solution but smaller than the size of abrasive particles to be retained on the first tape segment. The first segment has a porous adhesive layer of relatively low tack level, the adhesive carrying the abrasive particles through a first, relatively weak bond. A second electrically non-conductive tape segment substantially …