Top imaged and organosilicon treated polymer layer developable with plasma
CA 1267378 C · Owner: Chiong, Kaolin N. · Inventors: Yang, Jer-Ming; Chiong, Kaolin N.; Chow, Ming-Fea
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract, The present invention is concerned with a method of converting the upper portion of a layer of polymeric resist into a dry etch resistant form. Oxygen plasma can then be used to develop the entire resist structure. The layer of polymeric resist is exposed to patterned radiation which creates labile and reactive hydrogens within the resist by molecular rearrangement. The reactive hydrogens within the upper portion of the layer are subsequently reacted with a silylating reagent to form a dry etch resistant compound. When the polymeric resist material is highly absorbent of the radiation, the reactive hydrogens are created only in the upper portion of the layer; when the polymeric …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted April 3, 1990. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended April 3, 2007.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.