Multilayer printed circuit board with domain partition
CA 1260625 A · Owner: Ncr Corporation · Inventors: Chen, Paul T.H.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A multilayer printed circuit board includes a plurality of substrates bonded together in which the surface area of each substrate is divided into equal surface areas in which each area may contain the same number and lengths of lines of conductive elements monitor holes, plated-through holes and circuit components. Connecting pads mounted within each substrate and intersected by a plated-through hole are positioned adjacent the conductive elements within the substrate and are connected to the elements by connecting segments. The circuit components mounted on a surface of the circuit board have their lead elements connected by bridge members to a monitor hole for testing purposes, said …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted September 26, 1989. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended September 26, 2006.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.