Hermetic high frequency surface mount microelectronic package

Abstract From the Canadian patent

A hermetic package for microelectronic circuits comprises a ceramic base with conductive hermetically, sealed vias that connect the metal ground plane on the bottom of the base to the circuit on the top a ceramic, frame sealed to the top of the base leads sealed between, the frame and the base and a lid sealed to the top of the, frame. The vias are cofired with the ceramic base and provide good power dissipation because of their thermal conductivity and good RF grounds to isolate different stages in the circuit. Because the vias are hermetically sealed no separate bottom component and no brazing operation is required to hermetically seal the package. The leads have a tapered section so the …