Plastic integrated circuit package having reduced moisture absorption
CA 1255396 A · Owner: Gte Products Corporation · Inventors: Johnson, Richard E.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An integrated circuit package for use in environments having a high moisture content has a plastic body having a given length and width and a thickness much less than said given length and width. The thickness exists between upper and lower surfaces of said body. A substantially moisture impervious layer is fixedly attached to the upper and lower surfaces. In a preferred form, the layers are metal selected from aluminum and copper.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 6, 1989. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 6, 2006.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.