Hybrid and multi-layer circuitry
CA 1253628 A · Owner: Olin Corporation · Inventors: Leedecke, Charles J.; Masse, Norman G.; Pryor, Michael J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a deoxidized or oxygen free copper alloy foil bonded thereto by a bonding glass. The copper alloy foil may be a circuit to which a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also layers of foil may be glass bonded to a substrate and stacked to form multi-layer circuits.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 2, 1989. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 2, 2006.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.