Thick bus metallization interconnect structure to reduce bus area
CA 1249070 A · Owner: Fairchild Semiconductor Corporation · Inventors: Asuncion, Andres D.; Brown, Robert; Hingarh, Hemraj
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
There is disclosed a structure for self aligned and non self aligned power and ground buses and interconnects for integrated circuits which are thicker than normal conductors. This enables them to withstand higher current densities without adverse electromigration effects. There is also disclosed a method for making such structures.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted January 17, 1989. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended January 17, 2006.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.