Packaged integrated circuit chip
CA 1238120 A · Owner: Gte Products Corporation · Inventors: O'Dean, Raymond D.; Gilder, Thomas G. Jr.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An IC chip package comprises a lead frame support on which lead frame segments are disposed. An IC chip is disposed on a pad area on the lead frame support. There is a cover on the support. A sealant material encircles the IC chip within the confines of the support and cover in order to seal the IC chip from the environment.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 14, 1988. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 14, 2005.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.