Method and structure for effecting engineering changes in a multiple device module package

Abstract From the Canadian patent

Method and Structure For Effecting Engineering Changes In A Multiple Device Module Package Abstract, In a semiconductor module with a substrate having a plurality of semiconductor devices mounted on the top surface, an internal metallurgy system interconnecting the devices, an auxiliary set of conductive lines with periodically occurring surface connecting terminals engineering change terminals with electrical connections to the device terminals and to the internal metallurgy system, the improvement being engineering change devices, terminals on the engineering change devices to establish electrical contact with the engineering change terminals and the surface connecting terminals a …