Method of making packaged ic chip
CA 1234926 A · Owner: Gte Products Corporation · Inventors: O'Dean, Raymond D.; Gilder, Thomas G. Jr.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
In the manufacture of a packaged IC chip a lead frame, segment has a plurality of leads the ends of which are, connected to opposing rails. After the leads are secured to a lead frame support, the rails are removed and an IC chip is then connected. The chip and lead frame are then encapsulated between the support and a cover.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted April 5, 1988. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended April 5, 2005.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.