Method for manufacturing multi-layered printed circuit boards and a circuit board produced by same
CA 1234923 A · Owner: Ecolab Inc. · Inventors: Pelligrino, Peter P.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Methods and apparatus for providing fine line high density, multiple layer printed circuit board packages are disclosed. In the method for fabricating multiple layer printed circuit board package, a printed circuit board is formed having a conductive circuit pattern embedded in and integral with an insulator material substrate, such that the surface of the conductive circuit pattern is exposed along one surface of the substrate and lays flush and coplanar with therewith. At least two of said boards are stacked with a layer of insulator material interposed between each pair of adjacent boards. The entire assembly is heat-pressed together to form a homogenous block of insulator material …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted April 5, 1988. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended April 5, 2005.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.