Packaging microminiature devices
CA 1232367 A · Owner: American Telephone And Telegraph Company · Inventors: Ng, Kwok K.; Sze, Simon M.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract, One or more silicon-integrated-circuit chips are attached, active side up, to the bottom side of a silicon wafer. A sloped-wall through-aperture is etched in the wafer in registry with a portion of the active side of each attached chip. A lithographically defined conductive pattern is then formed on the top side of the wafer and on the sloped walls to connect conductive pads on each chip to conductive pads on other chips and/or to conductive terminals disposed along the periphery of the wafer. The resulting packaged chip assembly has advantageous performance and cost characteristics.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted February 2, 1988. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended February 2, 2005.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.