Heat sink for electronic components
CA 1211861 A · Owner: Philips Electronics N.V. · Inventors: Glaser, Chris
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
PH. 25.110, ABSTRACT:, A heat sink assembly especially adapted for use with semiconductors having flat packages such as of the TO-220 type wherein a heat sink mounting surface is bounded by two upstanding walls having outer edge flanges inturned over the mounting surface to cooperate with a spring clip to press a mounted component against the heat sink surface. Mounting bolts and/or holes in the mounting surface are dispensed with and the assembly is low cost and simple to use.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted September 23, 1986. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended September 23, 2003.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.