Resin-molded semiconductor device and a process for manufacturing the same
CA 1206819 A · Owner: Hitachi, Ltd. · Inventors: Misawa, Yutaka; Hidaka, Toshiyuki; Fukuhara, Toshiaki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract:, The invention provides a process for manufacturing a semiconductor device and the semiconductor device so produced. In particular, the process permits a semiconductor pellet to be sealed in an epoxy resin in a manner that does not require the use of a mold. The epoxy resin is dropped onto the pellet as the pellet is turned. The epoxy resin its then heated at 160-180°C for 2 to 10 minutes as the pellet is turned, so that the surface portions of the epoxy resin are hardened. The resin is then heated at 160-200°C for 3 to 24 hours while the pellet is kept stationary in order to complete the hardening of the resin. The avoidance of the use of a mold means that a very satisfactory …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted July 2, 1986. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended July 2, 2003.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.