Method of and device for placing chip-type electrical and/or electronic components on a substrate
CA 1204528 A · Owner: N.V. Philips Gloeilampenfabrieken · Inventors: Wardenaar, Hendrik C.; Kuppens, Bernardus J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
13-, ABSTRACT:, "Method of and device for placing chip-type eleotrical and/or electronic components on a substrate". A method of and a device for placing chip type components on a substrate, in which a number of components are simultaneously picked up in presentation positions by means of a pick-up device which comprises a number of pick-up elements, after which the pick-up device is moved to a position over the substrate and each of the pick-up elements in succession is moved to a position over the desired position on the substrate by movement of the pick-up device and/or the substrate with respect to one another, after which the relevant component is deposited and released in the relevant …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 13, 1986. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 13, 2003.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.