Polymeric films for electronic circuits

Abstract From the Canadian patent

Electronic circuits are described in which plasma-deposited polysiloxane films 45 are used as protective and dielectric layers. Such layers are highly advantageous in that, they are chemically inert exhibit excellent thermal stability and have low dielectric constant. Electronic circuits with these films may be processed at relatively high temperatures without damage and have minimum parasitic capacitances where conductor spacing is extremely small and access times are very short. The layers are particularly useful for high density, high frequency memory and logic circuit.