Unitary slotted heat sink for semiconductor packages
CA 1204523 A · Owner: International Business Machines Corporation · Inventors: Horvath, Joseph L.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Unitary Slotted Heat Sink, for Semiconduator Packages Abstract, A unitary heat sink for a semiconductor package having a plurality of cooling fin elements, each element having upwardly extending openings that divide the base into a plurality of leg portions, the heat sink having a plurality of flat base portions individually bonded to a surface of the package, each of the leg portions of an individual fin element being integral with different but adjacent flat base portions, in operation the heat sink preventing a build-up of stresses at the bonded interface of the base portions and package due to differential coefficient of expansions of the heat sink and package.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 13, 1986. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 13, 2003.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.