Low temperature electronic package

Abstract From the Canadian patent

Abstract The invention is a right angle connection utilizing an interposer rod between horizontal and vertical substrates. The interposer rod is of insulating material and has a superconducting metal ground plane on its surface, which ground plane is in turn covered by an insulating film. Over the insulating film, the interposer has a number of arcuate conductors to which respective conductors of both the horizontal and vertical substrates are connected at controlled collapse pads. This provides good electrical and mechanical connection. All circuits are effectively transmission lines because the underlying ground plane is continuous. The interposer rod provides a robust low inductance, …