Semiconductor integrated circuit including a lead frame chip support
CA 1201820 A · Owner: American Telephone And Telegraph Company · Inventors: Graver, Ronald N.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract, In an integrated circuit package the central, "paddle" of the lead frame on which the semiconductor chip (17) is mounted comprises two separate electrically, isolated portions (10,11) which extend beyond edges of the chip and which is each electrically connected to a different terminal pin of the package. External power is applied to these two chip support portions by means of which electrical power can be distributed to numerous areas (as desired) on the chip via bonding wires (23,24) extending between the chip areas and the paddle portions (FIG. 2).
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted March 11, 1986. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended March 11, 2003.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.