Masking of holes in circuit patterns on circuit boards prior to flow soldering

Abstract From the Canadian patent

Abstract of the Disclosure, A circuit pattern on a circuit board usually has a number of contact areas to which components are soldered. Some of the contact areas have holes extending through the board for insertion of leads of leaded components the leads then being flow, soldered to the contact areas. It often occurs that additional leaded components are to be mounted on the board after a first flow soldering step. However, holes through which the leads are to pass can be closed by solder. These holes are therefore masked mechanically, by a masking member which contacts the board at these holes, or by tape, or other such method. The present invention uses a conventional solder resist …