Contact structure for securing a semiconductor substrate to a mounting body
CA 1189984 A · Owner: Matsushita Electronics Corporation · Inventors: Hattori, Hirotsugu; Kuwagata, Masahiro
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A contact structure for securing a semiconductor substrate to a mounting body in a semiconductor device. A multi-layered electrode formed on a surface of the semiconductor substrate, the multi-layered electrode comprising a chromium-nickel alloy layer formed on the surface a nickel layer formed, thereon and a noble metal layer selected from the group consisting of gold silver, palladium and platinum formed further thereon a solder layer, and a, mounting means for holding the semiconductor substrate thereon the solder, layer soldering the multi-layered electrode to the mounting means thereby, bonding the semiconductor substrate to the mounting means. The foregoing construction has the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted July 2, 1985. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended July 2, 2002.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.