Package for a semiconductor chip
CA 1188010 A · Owner: Western Electric Company, Incorporated · Inventors: Schaper, Leonard W.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract A package for a semiconductor chip includes as an integral part thereof a frame-shaped multilayer ceramic capacitor. The chip is mounted within the capacitor structure. Conductive portions of the capacitor serve as the terminals and plates of the capacitor and as planar power and ground members for interconnecting an external power supply to the chip. By means of these planar members, power is distributed to the chip in a lowimpedance, substantially transient-free manner without utilizing any of the multiple signal leads emanating from the package. Moreover, the signal leads are separated from the ground plane by a low-dielectric-constant material. As a result, the signal leads are …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 28, 1985. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 28, 2002.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.