Cast solder leads for leadless semiconductor circuits
CA 1187674 A · Owner: Western Electric Company, Incorporated · Inventors: Fisher, John R. Jr.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier protecting the underlying circuitry, and accounting for stresses which may develop due to thermal mismatch between the chip carrier and the board and, to board flexure. Herein disclosed is a lead for semiconductor chip carriers comprising an elongated body of high melting point electrically conductive material, e.g. solder material. Also disclosed is a method for casting such a solder lead and a method for attaching a plurality of cast solder leads to a …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 28, 1985. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 28, 2002.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.