Soldering composition
CA 1165647 A · Owner: Copper Development Association, Inc. · Inventors: Beal, Roy E.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A zinc-based composition comprising from 0.01 to 5 percent lead and 0.01 to 20 percent tin preferably minor, amounts of chromium and/or titanium and/or nickel and with the balance being zinc is provided. A minor amount of copper may also be present. The composition is particularly useful for joining copper and copper alloys because it will wet and readily flow on the copper or copper alloy surfaces. It also has reduced dissolving action on the copper and copper alloys due to its reduced reactivity with them. It also has improved conductivity vis-a-vis conventional lead-tin and lead-tin-silver solders.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted April 17, 1984. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended April 17, 2001.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.