Heat dissipator for a dual in line integrated circuit package
CA 1164106 A · Owner: Calabro, Anthony D. · Inventors: Calabro, Anthony D.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A heat dissipator for use with a dual in line integrated circuit package. The subject dissipator is unitary in construction and formed of a resilient material to facilitate rapid mounting and subsequent removal from an IC package. The dissipator includes a pair of opposed top and bottom contact plates interconnected by an intermediate segment. A radiator plate is provided extending upwardly from the remaining free end of the top contact plate. The dissipator may be slidably mounted on an IC package, with the bottom contact plate being in contact with the bottom wall of the package and with the top contact plate being in coplanar and contiguous relationship with the top wall of the package. …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted March 20, 1984. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended March 20, 2001.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.