Arrangement for carrying electrical and/or electronic components

Abstract From the Canadian patent

An arrangement for mounting circuit components which operate at high power densities at high potential levels which, arrangement includes means defining a major and a minor insulating layer on the latter of which the components are mounted the, arrangement including a metal shield embedded between major and minor insulating layer and formed to partly surround the components and a connection for applying to the metal shield a potential selected to minimize the potential between the components and the shield, wherein the shield and the minor layer are formed for enabling the shield to receive power dissipated by the components at high heat flux density and for heat received by the shield to …