I.c. chip mounting assembly and a method of manufacturing such assembly
CA 1162392 A · Owner: Amp Incorporated · Inventors: Keller, Joseph R.; Olsson, Billy E.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An IC chip mounting assembly comprises a lead frame providing a heat sink (3) and leads (4 5, 6), and a, housing (2) moulded on to the lead frame and providing a cavity (7) in which the chip (11) is received the housing, (2) having a wall (9) formed on the heat sink (3) with an aperture (10) in the wall (9) to receive and locate the chip (11). The wall (9) is also formed with a number of solder wells (13) in communication with the aperture (10) which solder wells (13) receive any excess solder (12) when the chip (11) is bonded to the heat sink (3) such bonding, being carried out with the use of an induction heating apparatus.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted February 21, 1984. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended February 21, 2001.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.