Die-stamped circuit board assembly for photoflash devices and method of making
CA 1160756 A · Owner: Gte Products Corporation · Inventors: Brower, Boyd G.; Broadt, David R.; Shaffer, John W.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A circuit board assembly and method of making wherein the assembly includes a dielectric substrate at least one radiation, sensitive switch and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without severing the switch material.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted January 17, 1984. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended January 17, 2001.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.