Apparatus for placing chip type circuit elements on a board
CA 1137652 A · Owner: Sony Corporation · Inventors: Ichikawa, Iwao; Kaimori, Kenichiro
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An apparatus for placing chip type circuit elements wherein the elements are supplied from a hopper and are laterally turned for placing the circuit elements on a template. The apparatus includes an accommodating member for temporarily storing circuit elements, a movable shutter member placed under the accommodating member so that the circuit elements in the accommodating member can be laterally turned and a template, member placed under the shutter member to receive the circuit elements dropped from the accommodating member when the shutter member is removed. The invention further discloses a method of bonding circuit elements placed on the template member onto a printed circuit board.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted December 14, 1982. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended December 14, 1999.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.